We are seeking a visionary Chief Technology Officer (CTO) or Senior Optical Packaging Engineer to lead the advancement of our polymer-based optical packaging technologies. This strategic leadership role is central to driving innovation in high-performance optical module design, automation, and process development. The successful candidate will spearhead core R&D initiatives, manage cross-functional engineering teams, and play a key role in scaling Lessengers’ manufacturing capabilities in alignment with our global business goals. This role is ideal for a technical leader who thrives in a fast-paced, entrepreneurial environment and is passionate about pioneering next-generation packaging solutions for high-speed optical communication systems.
주요 업무
Technology Leadership & Development
Lead the development of polymer-based optical packaging technologies with a strong focus on
process automation, precision assembly, and scalability.
Define and oversee technical strategy across packaging design, prototyping, and transition to volume
manufacturing.
Act as a key contributor in the development and optimization of high-precision alignment and
assembly processes for photonic devices.
Team Building & Mentorship
Mentor and train engineering teams in advanced optical packaging techniques using proprietary tools
and processes.
Build a high-performance engineering culture driven by innovation, collaboration, and continuous
improvement.
Provide leadership at the Gwangju site (preferably as its General Manager), setting direction and
ensuring effective operational execution.
Cross-Functional Collaboration
Partner with the product development and manufacturing teams to translate design concepts into
manufacturable solutions.
Lead technical communication and reporting activities, including the preparation of documentation
for customers, industry partners, and internal stakeholders.
Quality & Standards Compliance
Ensure engineering practices meet Lessengers’ Quality Management System and safety standards.
Promote rigorous testing, calibration, and validation of packaging processes and optoelectronic
assemblies.
자격요건
Proven experience in optical packaging processes, including:
Fiber array attachment to photonic devices
High-precision alignment, warpage control, and laser coupling
Characterization of optoelectronic devices and silicon photonic ICs
Hands-on experience in developing scalable packaging routines and automation protocols.
Strong understanding of photonic integration and process engineering in a production or prototyping
environment.
우대사항
Ph.D. in Optical Engineering, Photonics, Materials Science, or related discipline with 5+ years of
industry experience.
Background in multi-disciplinary teams involving optics, electronics, and automation.
Familiarity with photonic packaging in communication systems and datacenter interconnects.
Experience with optical simulation, mechanical modeling, and systems-level design.
Excellent time and project management skills with a strong execution track record
복지 및 혜택
What We Offer
Strategic leadership role in a company pioneering high-performance optical transceiver technologies
for AI/HPC markets.
Opportunity to shape the future of photonic packaging innovation and contribute to global
technology leadership.
A collaborative, engineering-driven culture committed to solving complex challenges with creativity and speed.
